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Computer chips: stronger ties can mitigate costs

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Bibliographic Details
Published in: Intereconomics year:2023; pages:283-284; volume:58; month:09; number:5; 58(2023), 5 vom: Sept., Seite 283-284
Authors and Corporations: Freund, Caroline L. (Author), McDaniel, Christine (Author)
Other Authors: McDaniel, Christine [Author]
Type of Resource: E-Book Component Part
Language: English
published:
2023
Series: Intereconomics, 58(2023), 5 vom: Sept., Seite 283-284
Subjects:
Technologiepolitik
Halbleiter
China
USA
Aufsatz in Zeitschrift
Source: Verbunddaten SWB
Lizenzfreie Online-Ressourcen
ISSN: 1613-964X
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