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A novel solution to improve saddle-shape warpage in 3D NAND flash memory

Bibliographic Details
Journal Title: Semiconductor Science and Technology
Authors and Corporations: Shi, Dandan, Xia, Zhiliang, Hu, Ming, Mei, Guozhu, Huo, Zongliang
In: Semiconductor Science and Technology, 35, 2020, 4, p. 045031
Type of Resource: E-Article
Language: Undetermined
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